PRODUCTS
MIS Chip Capacitors
DESCRIPTION
Transcom's MIS Chip Capacitors are available in a wide range of sizes and capacitance values. They are designed to be use as DC blocks coupling filter elements, RF bypass, microwave circuit resonant elements and a fixed capacitance tuning elements in filters, oscillators, and matching networks.
The devices have long-term stability making them suitable for high reliability application. The temperature coefficient is less than 200 ppm/°C, and operation is suitable from –65 °C to 200 °C. Differing from ceramic capacitors,Transcom's MIS Chip Capacitors have high Q and lower insertion loss of 0.1 dB in a 50W system. Insulation resistance is greater than 106 MW.
The wafers are supplied on expanded 6" hoop for high volume automated assembly methods and 100% DC tested to assure consistent quality. Capacitors are packaged in gel packs and 100% visual inspection is always available if required.
DIE ATTACH AND WIRE BONDING
Transcom's MIS chip capacitors are processed with a high quality gold metallization for thermo-compression, thermo-sonic or ultrasonic wire bonding. The top plate of the capacitors is 99.99% sputtered gold with a TiW barrier and typical 3 mm of Au which is suitable for Gold-tin or gold germanium eutectic solders.Epoxy die attach is also acceptable.
ELECTRICAL SPECIFICATIONS
Capacitance Range | 0.2 to 550 pF |
Capacitance Thickness | 0.004" ± 0.001" |
Capacitance Tolerance | ± 20% |
Operating temperature | -65 °C to 200 °C |
Temperature Coefficient | 50 ppm/°C Typical |
Dielectric Withstanding Voltage | 50 V Typical |
Insulation Resistance | 106 Megohms Typical |
Leakage Current | Typical < 1nA |
ROHS Status | Compliant |
TABLE OF PART NUMBER
Part Number | Capacitance (±20%,pF) | Chip Type |
TCCXXXX4A | 0.2 ~ 4.5 | A |
TCCXXXX4B | 0.6 ~ 13 | B |
TCCXXXX4C | 3 ~ 50 | C |
TCCXXXX4D | 1.6 ~ 30 | D |
TCCXXXX4E | 55 ~ 550 | E |
TCCXXXX4F | 1 ~ 20 | F |
TCCXXXX4G | 8 ~ 110 | G |
TCCXXXX4H | 0.2 ~ 3.7 | H |
TCCXXXX4I | 2 ~ 27 | I |
TCCXXXX4Q | 45 ~ 450 | Q |
TCCXXXX4S | 15 ~ 155 | S |
Any capacitance or chip type not listed here. Please contact Transcom for further information! Thanks!
TYPICAL INSERTION LOSS VS. FREQUENCY (50 pF on 50 ohm system)
PART NUMBER INFORMATION
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MIS CHIP CAPACITORS PRODUCTS SELECTION GUIDE (DOWNLOAD PDF)
OUR PRODUCTS
Based on our PHEMT technology, Transcom has successfully developed product lines of MMICs.