|
MIS Chip Capacitors
DESCRIPTION
Transcom's MIS Chip Capacitors are available in a wide range of sizes and capacitance values. They are designed to be use as DC blocks coupling filter elements, RF bypass, microwave circuit resonant elements and a fixed capacitance tuning elements in filters, oscillators, and matching networks.
The devices have long-term stability making them suitable for high reliability application. The temperature coefficient is less than 200 ppm/°C, and operation is suitable from –65 °C to 200 °C. Differing from ceramic capacitors,Transcom's MIS Chip Capacitors have high Q and lower insertion loss of 0.1 dB in a 50W system. Insulation resistance is greater than 106 MW.
The wafers are supplied on expanded 6" hoop for high volume automated assembly methods and 100% DC tested to assure consistent quality. Capacitors are packaged in gel packs and 100% visual inspection is always available if required.
DIE ATTACH AND WIRE BONDING
Transcom's MIS chip capacitors are processed with a high quality gold metallization for thermo-compression, thermo-sonic or ultrasonic wire bonding. The top plate of the capacitors is 99.99% sputtered gold with a TiW barrier and typical 3 mm of Au which is suitable for Gold-tin or gold germanium eutectic solders.Epoxy die attach is also acceptable.
ELECTRICAL SPECIFICATIONS
| Capacitance
Range |
0.2 to 550 pF |
| Capacitance
Thickness |
0.004" ± 0.001" |
| Capacitance
Tolerance |
± 20% |
| Operating
temperature |
-65 °C to 200 °C |
| Temperature
Coefficient |
50 ppm/°C Typical |
| Dielectric
Withstanding Voltage |
50 V Typical |
| Insulation
Resistance |
106 Megohms Typical |
| Leakage
Current |
Typical < 1nA |
TABLE OF PART NUMBER
| Part Number |
Capacitance
(±20%,pF) |
Chip
Type |
| TCCXXXX4A |
0.2 ~ 4.5 |
A |
| TCCXXXX4B |
0.6 ~ 13 |
B |
| TCCXXXX4C |
3 ~ 50 |
C |
| TCCXXXX4D |
1.6 ~ 30 |
D |
| TCCXXXX4E |
55 ~ 550 |
E |
| TCCXXXX4F |
1 ~ 20 |
F |
| TCCXXXX4G |
8 ~ 110 |
G |
| TCCXXXX4H |
0.2 ~ 3.7 |
H |
| TCCXXXX4I |
2 ~ 27 |
I |
| TCCXXXX4Q |
45 ~ 450 |
Q |
| TCCXXXX4S |
15 ~ 155 |
S |
Note: The specified capacitors on this list are not limited to Transcom's capability for MIS chip capacitors.
Any capacitance or chip type not listed here. Please contact Transcom for further information! Thanks!
TYPICAL INSERTION LOSS VS. FREQUENCY (50 pF on 50 ohm system)
PART NUMBER INFORMATION
| Chip type of
B,C,D,E,F,G,Q,S |
Chip
type of dimensions (mils)
| Outline |
B |
C |
D |
E |
F |
G |
Q |
S |
| X |
7 |
7 |
11 |
47 |
9 |
21 |
56 |
36 |
| X1 |
10 |
10 |
14 |
50 |
12 |
24 |
60 |
40 |
| Y |
7 |
27 |
11 |
47 |
9 |
21 |
31 |
18 |
| Y1 |
10 |
30 |
14 |
50 |
12 |
24 |
35 |
22 |
X1,
Y1 Tolerance:+/- 1 mil |
Outline Drowings(mils)
 |
| Chip type of
A,I |
Chip
type of dimensions (mils)
| Outline |
A |
I |
| 1 |
2 |
1 |
2 |
| X |
7 |
2.4 |
16 |
7 |
| X1 |
10 |
10 |
20 |
20 |
| Y |
2.4 |
2.4 |
7 |
7 |
| Y1 |
10 |
10 |
20 |
20 |
X1,
Y1 Tolerance:+/- 1 mil |
Outline Drowings(mils)
 |
| Chip type of
H |
Chip
type of dimensions (mils)
| Outline |
H |
| X |
5 |
| X1 |
14 |
| Y |
3 |
| Y1 |
10 |
X1,
Y1 Tolerance:+/- 1 mil |
Outline Drowings(mils)
 |
 MIS Chip Capacitors Datasheet 
|
