 DESCRIPTION |
¡@¡@Transcom's MIS Chip Capacitors are available in a wide range of sizes and capacitance values.
They are designed to be use as DC blocks coupling filter elements, RF bypass, microwave circuit resonant elements and a
fixed capacitance tuning elements in filters, oscillators, and matching networks.
¡@¡@The devices have long-term stability
making them suitable for high reliability application. The temperature coefficient is less than 200 ppm/¢XC, and operation
is suitable from ¡V65 ¢XC to 200 ¢XC.
Differing from ceramic capacitors,Transcom's MIS Chip Capacitors have high Q and lower insertion loss of 0.1 dB in a 50W system.
Insulation resistance is greater than 106 MW.
¡@¡@The wafers are supplied on expanded 6" hoop for high volume automated assembly methods and 100% DC tested to assure consistent quality.
Capacitors are packaged in gel packs and 100% visual inspection is always available if required. |
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| DIE ATTACH AND WIRE BONDING |
¡@¡@Transcom's MIS chip capacitors are processed with a high quality gold metallization for thermo-compression,
thermo-sonic or ultrasonic wire bonding. The top plate of the capacitors is 99.99% sputtered gold with a TiW barrier
and typical 3 mm of Au which is suitable for Gold-tin or gold germanium eutectic solders.Epoxy die attach is also
acceptable. |
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| ELECTRICAL SPECIFICATIONS |
| Capacitance Range | 0.2 to 550 pF |
| Capacitance Thickness | 0.004" ¡Ó 0.001" |
| Capacitance Tolerance | ¡Ó 20% |
| Operating temperature | -65 ¢XC to 200 ¢XC |
| Temperature Coefficient | 50 ppm/¢XC Typical |
| Dielectric Withstanding Voltage | 50 V Typical |
| Insulation Resistance | 106 Megohms Typical |
| Leakage Current | Typical < 1nA |
|
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| TABLE OF PART NUMBER |
| Part Number |
Capacitance (¡Ó20%,pF) |
Chip Type |
| TCCXXXX4A | 0.2 ~ 4.5 | A |
| TCCXXXX4B | 0.6 ~ 13 | B |
| TCCXXXX4C | 3 ~ 50 | C |
| TCCXXXX4D | 1.6 ~ 30 | D |
| TCCXXXX4E | 55 ~ 550 | E |
| TCCXXXX4F | 1 ~ 20 | F |
| TCCXXXX4G | 8 ~ 110 | G |
| TCCXXXX4H | 0.2 ~ 3.7 | H |
| TCCXXXX4I | 2 ~ 27 | I |
| TCCXXXX4Q | 45 ~ 450 | Q |
| TCCXXXX4S | 15 ~ 155 | S |
|
| Note: The specified capacitors on this list are not limited to Transcom's
capability for MIS chip capacitors. Any capacitance or chip type not listed here.
Please contact Transcom for further information!¡@Thanks! |
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| TYPICAL INSERTION LOSS VS. FREQUENCY (50 pF on 50 ohm system) |
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| PART NUMBER INFORMATION |
| ¡@Chip type of B,C,D,E,F,G,Q,S |
Chip type of dimensions (mils)
| Outline | B |
C | D |
E | F |
G | Q | S |
| X | 7 | 7 | 11 |
47 | 9 | 21 | 56 | 36 |
| X1 | 10 | 10 | 14 |
50 | 12 | 24 | 60 | 40 |
| Y | 7 | 27 | 11 |
47 | 9 | 21 | 31 | 18 |
| Y1 | 10 | 30 | 14 |
50 | 12 | 24 | 35 | 22 |
X1, Y1 Tolerance:+/- 1 mil
|
Outline Drowings(mils)
 |
| ¡@Chip type of A,I |
Chip type of dimensions (mils)
| Outline | A |
I |
| 1 | 2 |
1 | 2 |
| X | 7 |
2.4 | 16 | 7 |
| X1 | 10 |
10 | 20 | 20 |
| Y | 2.4 |
2.4 | 7 | 7 |
| Y1 | 10 |
10 | 20 | 20 |
X1, Y1 Tolerance:+/- 1 mil
|
Outline Drowings(mils)
 |
| ¡@Chip type of H |
Chip type of dimensions (mils)
| Outline |
H |
| X | 5 |
| X1 | 14 |
| Y | 3 |
| Y1 | 10 |
X1, Y1 Tolerance:+/- 1 mil
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Outline Drowings(mils)
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